DICING TAPE_UV Dicing Tape_UV type

APPLICATION-DICING TAPE

Overview

Pressure-sensitive adhesive type is used while dicing various types of wafers. We provide the best possible tapes to meet your ever diversify range of needs. UV type is used while dicing a wide range of workpieces, including various types of wafers, package substrates, ceramics, glass and crystal. For the ease of peeling, UV dicing tape is exposed to UV light, thereby weakening its adhesive strength

Features

Superior storage time stability
Two available colors: milky white and light blue
Anti-static types are also available (optional)

Product Number

F-90MW / T-80HW

Dicing Tape (UV Type)

Overview

Features

Wide range of items available with different adhesive thickness
Prevent from die-fly and chipping (cacking) on the backside surface
Easy pickup (easy to peel)
Exhibts surperior adhesive qualities for workpieces that are incredibly anti-adhesive, such as those made from EMC (epoxy molding compounds)
Anti-static types are available (optional)

Product Number

UDV-80J / UDV-100J / UHP-0805MC / UHP-110AT / UHP-100B UHP-110BZ / UHP-110M3 / UHP-1025BZ / UDT-100M3 UDT-1005M3 / UDT-1025M3 / UDT-1025MC / UDT-1025SG UDT-1915MC

Product Features

• THERMO SHEET EC - Electrical conductivity with carbon black, PS & PC based grades available, 3 layers with stable electrical conductivity.

• THERMO FILM - Cover tape film, PS, PC, PEC, PVC. Excellent sealing for heat-seal embossed carrier tapes, good peeling characteristics.

• ELEGRIP TAPE (Back Grinding Tape) - Protect the circuit surface “r”, excellent adhesion to uneven wafer surfaces on the circuit side, effective control of particles.

• ELEGRIP TAPE (Dicing Tape) - Excellent control to back-side chipping fly-off, excellent over-time stability (T Series), excellent adhesiveness (shape-following properties), excellent expandability peeling.

Services Info